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[May 9, 2025 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading provider of test and inspection systems, announces that the 3D SEMI AOI TR7700Q SII-S has obtained the SEMI E187 certification, regarding cybersecurity for the semiconductor manufacturing equipment.

The TR7700Q SII-S is an AI-powered 3D SEMI AOI that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The SEMI AOI is equipped with a 25MP camera, 2.5 µm high-resolution, and a new mechanical design, setting new standards in accuracy.

SEMI E187 aims to eliminate vulnerabilities exploited in external and network attacks. The SEMI Standard defines cybersecurity requirements for semiconductor fab equipment, focusing on operating system support, network security, endpoint protection, and security monitoring. This standard is crucial for securing semiconductor manufacturing against cyber threats. The certification ensures semiconductor manufacturers can integrate TRI's technology with confidence, meeting stringent security standards.

For more information about TRI's SEMI Solutions, please visit the link below,
https://www.tri.com.tw/en/product/product-85-2.html

 

About TRI

Test Research, Inc. (TRI) provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements, from Automatic Test and Inspection solutions to Board Testing. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.