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[May 11, 2018 – Taipei, Taiwan] Multi Components GmbH, Test Research, Inc.'s (TRI) European distributor, will exhibit a comprehensive Smart Factory Inspection Solution, combining 3D SPI, 3D AOI and 3D CT AXI at SMT Hybrid Packaging 2018 exhibition in Nürnberg, Germany. Discover the leading One Stop Solution for PCBA Inspection at Booth #318 in Hall A4 of Nürnberg Messe from June 5 to June 7, 2018.

TRI's lineup for SMT Hybrid Packaging 2018 will include 3D CT AXI TR7600 SIII, industry's fastest high resolution of 7μm. TRI will also showcase the high performance 3D AOI TR7500QE, designed for zero-escape industry applications. Also featured this year is TR7007 SII 3D SPI, the fastest solder paste inspection system in the industry, offering inspection speeds of up to 200cm²/sec.

Increase the quality of your PCB inspection, maximize the value in the production line and minimize quality costs with TRI's hallmark solutions. Visit Booth 318 in Hall A4 of SMT Hybrid Packaging 2018 at Nürnberg Messe for more information.


About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Tester and Functional Tester (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, contact us at marketing@tri.com.tw or call +886-2-2832-8918.