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Advanced Packaging Inspection at SEMICON SEA 2024


[April 1, 2024 – Kuala Lumpur, Malaysia] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at the Malaysia International Trade and Exhibition Centre (MITEC), from May 28 - 30, 2024. Visit booth #3920 to experience the latest in Smart Factory Semiconductor Inspection.

TRI's AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

Also exhibiting will be the 3D Semiconductor and Advanced Packaging Optical Inspection TR7900Q SII for semiconductor industry applications with built-in magazine loader/unloader, 2.5 µm high resolution, and an outstanding 25MP camera. The TR7900Q SII can inspect Die Bonding, Ball Bonding, Ribbon Bond, Wedge Bond, Wire Bonding, SiP, underfill, SMD, bumps, and solder joints.

Die Bonding Heavy Wedge Bond Wire Profile Tracing Wafer Chip Metrology Scratch on Die

TRI will also showcase the high accuracy and stability 3D SEMI SPI TR7007Q SII-S for precise solder measurements. The lineup will also include an X-ray Inspection Demo Station.

Stop by TRI's booth to discuss Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff. For more information about TRI's Inspection capabilities for the Semiconductor and Advanced Packaging Industry, please follow this Link.

About TRI

Test Research, Inc. (TRI) provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements, from Automatic Test and Inspection solutions to Board Testing. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at trimy@tri.com.tw or call +604 6461171.