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[August 19, 2025 – New Delhi, India] Test & Research India PVT, LTD. (T&R India), TRI's distributor, will join SEMICON India 2025 at Yashobhoomi (IICC), New Delhi, India from September 2 – 4, 2025.

Visit booth No. 1413 to experience the latest in Inspection and Metrology for the advanced packaging and semiconductor industry.

T&R India will exhibit TRI's AI-powered 3D AOI for Back-end applications, TR7700Q SII-S, with capabilities to inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The TR7700Q SII-S is equipped with a 2.5um high-resolution 25MP camera, AI solutions, and Precise Metrology measurements.

TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.

For more information about TRI's SEMI Inspection and Metrology Solutions, please visit the link below,
https://www.tri.com.tw/en/product/product-85-2.html
 

About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.

About Test & Research India PVT. LTD.

Test & Research India PVT. LTD. plays a leading role in the electronics, information, and communication industries as a one-stop solution provider SMT portfolio. T&R India introduces excellent Printer, Reflow, Conveyor, Inspection and testing equipment & ICT Fixtures in India, offering customers outstanding products and comprehensive services. Learn more at http://testindia.co.in/.