[May 4, 2023 – Penang, Malaysia] INETest is partnering with Test Research, Inc. (TRI) at the SEMICON SEA exhibition in Penang, Malaysia. Visit INETest at booth #C513 in SEMICON SEA at the Setia SPICE Convention Centre from May 23 - 25, 2023.
TRI's AI-powered Inspection solutions for the
Semiconductor and Advanced Packaging Industry can inspect Die / Wire / Wedge / Ball / Ribbon Bonding, Cross Wire, BBOS/BSOB, SiP, WLCSP, Underfill, Bumps, Cu Pad/Pillar, Epoxy, Flux, Glue, and foreign material detection.
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Die Bonding |
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AI Wire Detection |
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IGBT Inspection |
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Wafer Chip Metrology |
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Scratch on Die |
TRI's Smart Factory innovations optimize the current Inspection through AI-powered algorithms, multiple 3D technologies, metrology-grade measurement, real-time SPC trends, and M2M communications. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).
Visit booth #C513 to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff.
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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at
http://www.tri.com.tw. For sales and service information, please write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
About INETest Malaysia Sdn Bhd
INETest Malaysia Sdn Bhd is a leading provider of distribution and service solutions to the semiconductor and electronics manufacturing industries, offering innovative engineering-focused solutions. Learn more at
https://www.ellipsiz.com/.
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