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2016/11/14

NEPCON JAPAN 2017 (2017/01/18~01/20)
：Tokyo Big Sight, Japan
：2017/01/18 ~ 2017/01/20

TRI will exhibit its newest PCBA test and inspection portfolio at ELECTROTEST booth E17-28 in NEPCON Japan 2017 held between January 18-20 at Tokyo Big Sight. Come visit us for a tour of latest news in 3D SPI, 3D AOI, CT AXI and multi-core ICT for data-driven Industry 4.0 productions.
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