[March 18, 2020 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-
resolution TR7700QE-S 3D AOI for the Semiconductor and Packaging Industry.
As the miniaturization of components and PCB boards increases, also does the demand for higher resolution inspection. The TR7700QE-S provides high accuracy and repeatability for the semiconductor & packaging industry. TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false calls rates.
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. Powered by Metrology precision and flexible inspection algorithms, the TR7700QE-S can inspect and detect defects in wire bonds, die bonds, SMD, bumps, Wafer IC/Chip, underfill, and solder joints.
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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at
www.tri.com.tw. For sales and service information, write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
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