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[September 23, 2024 – Taipei, Taiwan] Test Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.

The Core Features 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, optional AI-powered solutions, and compliance with the latest Smart Factory standards. Featuring a 12 MP High-Speed Camera, it offers four factory-setting configurations ranging from high-resolution 10 μm to high-speed 15 μm.

Powered by IPC-610-compliant algorithms, the 3D AOI system can inspect the most intricate solder joint defects, including THT components. Interactive 3D models help operators quickly review detected defects, such as lifted BGA components, IC leads, connectors, switches, and other mounted devices.

The TR7700QC SII also features the Multi-Step Function, enabling efficient inspection of both tall (up to 40 mm) and short components during the same inspection. The TR7700QC SII supports current Smart Factory Standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
 
Please visit the following link below to learn more about the TR7700QC SII Series:
https://www.tri.com.tw/en/product/product_detail-11-2-1817-1.html

 

About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.