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2017/04/17
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[April 17, 2017 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a technology seminar held in Penang, Malaysia. The one-day event will focus on the latest technology innovations in TRI's comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing. |
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TRI's 2017 lineup features high performance CoaXPress upgrades to 3D AOI and 3D SPI solutions the TR7700QE and TR7007Q series. Also launching in 2017 is TR7600 SIII, TRI's new generation inline 3D CT AXI with line-speed high accuracy inspection and Multi-Core Parallel ICT series TR5001 SII with a complete range of inline and standalone configurations.
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Venue |
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Penang, Malaysia |
May 18, 2017 |
Eastin Hotel Penang |
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Discover how TRI's PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. TRI's systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.
To register for the seminar, please contact your TRI sales representative.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, contact us at marketing@tri.com.tw or call +886-2-2832-8918. |
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