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TRI Reveals 2016 Innovations at Seminars in Taiwan, Suzhou and Shenzhen

2016/01/28

[January 28, 2016 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a series of technology seminars and product demos held in Shenzhen, Suzhou and Taiwan. Each of the one-day events will focus on latest technology innovations in TRI's comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 data-driven manufacturing.

Location	Date	Venue
Shenzhen 深圳	March 23, 2016	Shangri-la Hotel, Shenzhen, 2F 深圳香格里拉大酒店2樓
Suzhou 蘇州	March 25, 2016	Swissôtel Kunshan 昆山瑞士大酒店
Taiwan 台灣	March 31, 2016	TRI Production Center, Linkou TRI林口生產中心

TR7700QI 3D AOI

TRI's 2016 portfolio includes new TR7700QI stop-and-go 3D AOI system with 3D solder fillet inspection designed for high-mix high-volume productions including mobile and PC applications. Also launching in 2016 are high accuracy stop-and-go 3D SPI TR7007QI and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete inspection lineup includes CT-capable 3D AXI system TR7600 SII CT and TRI's acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, contact us at marketing@tri.com.tw or call +886-2-2832-8918.

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