Noticias

[March 6, 2023 – Taipei, Taiwan] Suzhou Ishikawa Automation Technology Co. (石川), TRI's distributor, will participate in productronica China 2023. The exhibition will be held at Shanghai New International Expo Centre (SNIEC), Shanghai, on April 13-15, 2023.

Visitors can experience the AI-powered 3D AOI, TR7700Q SII, with improved image quality at an industry-leading speed of up to 57 cm²/sec. The TR7700Q SII can deploy multiple 3D technologies and high resolution of 3.45 μm satisfiying multiple industry demands, including the Semiconductor and Advanced Packaging Industry. The TR7700Q SII is able to inspect die bonding, ball bonding, ribbon bond, wedge bond, wire bonding, SiP, underfill, SMD, bumps, and solder joints.

Furthermore, TRI will showcase the recently released 3D SPI TR7007Q Plus, along with TRI's automated 3D X-Ray Inspection solution demo. TRI's 2022 lineup features Smart Factory innovations that optimize the current Inspection through AI-powered algorithms, multiple 3D technologies, metrology inspection, real-time SPC trends, and M2M communications.

Visit Suzhou Ishikawa Automation Technology Co. (石川) Booth #N4.4358 and discover the World-class Test and Inspection for the PCB Assembly Industry.

Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems inter-operate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.

 

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