Noticias

[August 8, 2022 – Taipei, Taiwan] Test Research, Inc. (TRI) will attend the NEPCON Asia 2022 held at Shenzhen World Exhibition & Convention Center from November 30th – December 2nd, 2022. Visit booth #D065, hall 13, to experience Smart Test and Inspection Solutions in action.

TRI is proud to showcase the High-Performance Multi-Camera 3D AOI, TR7500QE Plus, for the first time. Capable of deploying multiple 3D technologies and full coverage side-view inspection to satisfy the industry demands and enable virtually zero-escapes Inspection.

The 2022 TRI Lineup for Asia's Leading PCBA technology Show will include the 3D SPI TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. Also exhibiting will be the AI-powered 3D AOI TR7700Q SII with an industry-leading high speed of up to 57cm²/sec.

TRI's lineup will include the high-end 3D AXI TR7600F3D SII, the High-speed 3D AXI TR7600 SIII, and the Multi-core ICT TR5001Q SII INLINE with LED Testing capabilities. TRI will also showcase the High Throughput and High Pin Count ICT TR8100H SII, with up to 11,088 testing points.

Discover TRI's new AI Solutions capable of optimized continuous Inspection deploying AI Models, reducing human errors, false calls, and operator costs.

TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload. TRI is actively participating in developing and adapting the emerging and pioneers Industry 4.0 and M2M Communication Standards. TRI solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.

 

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