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Semiconductor Industry
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The miniaturization of electronics components demands higher resolution and drives the production to increase the need for precise inspection solutions. TRI inspection platforms have robust metrology capabilities that enable high-reliability inspection, lowering the false call rates.
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Features
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Inspection For: |
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Advanced Packaging Defect Detection
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Die Bonding |
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Defects: Missing Die, Die Reverse, Die Shift, Die Rotation, Die Tilt, Die Chipping, Die Crack, Scratch Die, Contamination, Excess Epoxy, Insufficient Epoxy and Epoxy on Product. |
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Wire Bonding |
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Defects: Broken Wire, Wire Short, Wire Sweep/Sink, Missing/Excess Wire, Ball Bond Diameter, Stitch Width, Stitch Coverage over Ball, Ball Bond Cannot Touch Pad Edge, Bond on Contamination/FM, Bump/Ball/Stitch Lifting and Neck Broken. |
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AI Wire Detection |
TRI Smart Inspection Solutions uses AI-powered algorithms to detect wire bonding. The AI algorithms detect defects such as un-bonded, missing wire, broken wire, wedge placement, ball-off pad, ball diameter, and more. |
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Metrology Inspection |
Easily create formulas with dimensional measurements, inspection parameters, and real measurement values to achieve a more precise inspection with less false calls and lower escape inspection. Metrology enables big data and Improves data traceability, ultimately improving the yield rate. |
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Optimal Focus Inspection |
TRI's 3D Imaging Technology Depth from Focus (DFF) searches for the optimal focus position and measures the depth of the image to achieve sharp inspection images. The 3D technology supports 0.5 μm/1 μm ultra-high-resolution inspection to defect defects related to the loop height, low landing, sagged wire, clubbed ball, and more. |
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