[February 19, 2024 – Taipei, Taiwan] Suzhou Ishikawa Automation Technology Co. (石川), TRI's distributor, will participate in productronica China 2024. The exhibition will be held at the Shanghai New International Expo Centre (SNIEC), Shanghai, on March 20-22, 2024. Visit booth #4530 to experience the latest in
Advanced Packaging and Electronics Manufacturing Inspection.
TRI will unveil the newly released 3D SEMI AOI, TR7700Q SII-S, built for high-reliability industries and equipped with superior specifications of a 25MP camera, 2.5 µm high-resolution, AI-Powered inspection algorithms, and precise Metrology measurements. The 7700Q SII-S is TRI's latest innovation for the Inspection of the Semiconductor and Advanced Packaging manufacturing Industry, able to inspect die bonding, ball bonding, ribbon bond, wedge bond, wire bonding, SiP, underfill, SMD, bumps, and solder joints.
Furthermore, TRI will showcase the recently released
3D SPI TR7007Q Plus, along with TRI's automated
3D X-ray inspection solution demo. TRI's Test and Inspection platforms enable big data and data traceability, essential for a Smart Factory environment. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).
Visit Suzhou Ishikawa Automation Technology Co. (石川) at Hall E4 Booth #4530 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.