We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
您欲前往的語系無此筆資料或無販售此產品,請選擇 [是] 前往=A=網頁瀏覽,或選擇 [否] 繼續前往=B=網頁瀏覽,或點選右上角X關閉視窗停留在原頁面
關於我們 產品介紹 新聞中心 客戶服務 投資人關係

新聞中心

TRI's Brand New SPI Series Wins at 2015 Global Technology Awards

2015/11/16

TRI's Brand New SPI Series Wins at 2015 Global Technology Awards
[November 11, 2015 – Taipei, Taiwan] Test Research, Inc. (TRI), a leading test and inspection systems provider for the SMT industry, announces that the company's TR7007Q Series 3D Solder Paste Inspection has been chosen as the best SPI solution of the year by the leading industry publication, Global SMT & Packaging. This marks the 5th industry award for TRI's leading SPI solutions, including Best in Test and EM Asia Innovation Awards. TRI's VP of Sales Jim Lin received the award at the Global Technology Award Ceremony held on November 10 at Productronica 2015 trade show in Germany, commenting: "We have taken great care developing a brand new platform underpinning our new generation stop-and-go inspection solutions. Combined with TRI's intuitive software, the TR7007Q series has become one of the most competitive solutions on the market, delivering outstanding value in the production line."

About the TR7007Q Series 3D SPI solution
Built upon latest 3D projection technology, the TR7007QI stop-and-go SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI's innovative SmartWarp system compensates for any board warpage during inspection. With a choice of quad/dual projector inspection, the TR7007QI is a versatile SPI solution bringing accuracy and speed to your fingertips.

                                     

About the Global Technology Awards
The Global Technology Awards have been recognizing the very best innovations in the printed circuit assembly and packaging industries since 2005. Each year, the field of entries is scored by an independent, international panel of judges on six different criteria—innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintainability/reparability— to determine the best new technologies and services introduced in the previous year

About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at marketing@tri.com.tw or call +886-2-2832 8918.