Test Research, Inc. (TRI), the leading test and inspection solutions provider for the electronics manufacturing industry will join
to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth
on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.
TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI will also exhibit the industry leading 3D AOI
TR7500QE offering top and side camera multi-angle high-accuracy Inspection.
Also being showcased, TRI's new cutting-edge Inline 3D AOI
TR7700Q with unprecedented 1um High-Resolution inspection capability. Discover TRI's world-class high-resolution and high speed 3D CT AXI
TR7600F3D and
TR7600 SIII CT. Finally complete your SMT Inspection and test tour with TRI's multi-core ICT
TR5001Q SII Inline.
Visit us at
IPC APEX EXPO 2019 booth
#2533 for a personal demonstration of TRI's industry leading world-class test and inspection solutions lineup.
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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) Solutions to Manufacturing Defect Analyzers (MDAs), In-Circuit Test (ICT), and Functional Tester (FCT), Test Research, Inc. provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at
http://www.tri.com.tw. For sales and service information, write us at
triusa@tri.com.tw or call +1 (408) 567-9898.