We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations

News

2016/11/14

NEPCON JAPAN 2017 (2017/01/18~01/20)

Event Location:Tokyo Big Sight, Japan
Event Date:2017/01/18 ~ 2017/01/20

TRI will exhibit its newest PCBA test and inspection portfolio at ELECTROTEST booth E17-28 in NEPCON Japan 2017 held between January 18-20 at Tokyo Big Sight. Come visit us for a tour of latest news in 3D SPI, 3D AOI, CT AXI and multi-core ICT for data-driven Industry 4.0 productions.