[May 14, 2021 – Taipei, Taiwan] Test Research, Inc. (TRI) presents the release of the new 3D high-speed solder paste inspection (SPI) solution TR7007 SII Ultra, performing at an industry-leading speed of up to 180 cm2/sec.
The TR7007 SII Ultra is built on the highly popular and award-winning TR7007 SII Plus Series and an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The TR7007 SII Ultra can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
Please visit the following link below to learn more about the TR7007 SII Ultra Series:
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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at
www.tri.com.tw. For sales and service information, write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
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