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News

TRI releases new ICT Solution: BSI Plus

2020/06/15

[June 15, 2020 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, is proud to present the new In-Circuit Tester (ICT) solution BSI Plus.

The BSI (Boundary Scan Interconnect) Plus is TRI's latest ICT solution for different connectors, such as DDR4, USB, PCIe and M.2 SATA. The BSI Plus hardware is easy to integrate into the fixture and setup for new test programs.
 

Please visit the following link below to learn more about the BSI Plus Series:
https://www.tri.com.tw/en/product/product_detail-14-2-1610-1.html

 
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About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From 3D Solder Paste Inspection (SPI), 2D and 3D Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.