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TRI Highlights Smart Factory Inspection Solutions at IPC APEX EXPO 2019

2018/12/14

[December 14, 2018 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection solutions provider for the electronics manufacturing industry will join IPC APEX EXPO 2019 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #2533 on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.
TRI's 2019 lineup features the industry's leading 3D SPI 
TR7007QI, for accurate shadow-free solder inspection with digital fringe projectors and smart board warpage control. TRI will also exhibit the industry leading 3D AOI TR7500QE offering top and side camera multi-angle high-accuracy Inspection.
Also being showcased, TRI's new cutting-edge Inline 3D AOI TR7700Q with unprecedented 1um High-Resolution inspection capability. Discover TRI's world-class high-resolution and high speed 3D CT AXI TR7600F3D and TR7600 SIII CT. Finally complete your SMT Inspection and test tour with TRI's multi-core ICT TR5001Q SII Inline.
Visit us at IPC APEX EXPO 2019 booth #2533 for a personal demonstration of TRI's industry leading world-class test and inspection solutions lineup.

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About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) Solutions to Manufacturing Defect Analyzers (MDAs), In-Circuit Test (ICT), and Functional Tester (FCT), Test Research, Inc. provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at triusa@tri.com.tw or call +1 (408) 567-9898.
 
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