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Test Research, Inc. to Highlight Latest Smart Factory Inspection Solutions at NEPCON Japan 2019

2018/12/13

[December 13, 2018 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join NEPCON Japan held at Tokyo Big Sight to showcase state-of-the-art Inspection Solution for Smart Factories. Visit booth #E17-4 to experience Smart Factory Inspection Solutions in action.
 
Meet the next generation of High-Quality AOIs at TRI's booth. Featuring the new TR7700 SV 3D AOI with improved Image quality at industry leading speed. Furthermore presenting the new Multi-Angle 3D AOI solution TR7500QE SII offering higher quality imaging for side view inspection.
 
Discover TRI's World-Class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. TRI will exhibit the Global Technology Award-winning TR7007QI series 3D SPI. Also showcasing, TRI's new cutting-edge Inline 3D AOI TR7700Q with unprecedented 1um Resolution for High Accuracy and Reliability Testing.  
 
Realize your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.


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About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) Solutions to Manufacturing Defect Analyzers (MDAs), In-Circuit Test (ICT), and Functional Tester (FCT), Test Research, Inc. provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at trijp@tri.com.tw or call +81-3-6273-0518.
 
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