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TR5001 INLINE
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TR5001 INLINE
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INTRODUCTION
Diese für Inline-Integration optimierte SMEMA-kompatible ICT ist als erweiterbare Plattform zum Testen von PCBAs entworfen. Der TR5001 IN LINE bietet eine sparsame, anpassbare Lösung, die die Testanforderungen der meisten Kunden in vollem Umfang erfüllen kann. Der TR5001 IN LINE enthält MDA mit wählbarer ICT- und Funktionstest-Funktionen, die Produktionslinien- Personalkosten senken, Testzeit sparen und die Produktivität erhöhen können.
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• Modulare Upgrade-Optionen von MDA zu ICT und Funktionstest
• SEMA-kompatible Inline-Testlösung für hohe Fehlerabdeckung
• Begrenzte Zugriffslösung und Funktionstesterweiterung mit PXI-Modulen
• Freundliche Benutzeroberfläche mit schneller und einfacher Programmentwicklung
Tester Specifications
Analog/hybrid test points |
3200 analog or maximum digital test points: 1600 |
Operating System |
Microsoft® Windows 10 |
Fixture Type |
Inline with long lifespan Quick Disconnection Interface |
Standard Testing Components
Analog Test Hardware |
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6-wire measurement switching matrix
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Measures voltage, current and frequency
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Component R/L/C/D measurement
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60 V high voltage current source for LED strip testing
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Optional Components
Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Board Handling
Min PCB Size |
70 x 70 mm |
Max PCB Size |
450 x 300 mm |
PCB Thickness |
0.6 - 5 mm |
Dimensions
WxDxH |
900 x 900 x 1645 mm
Note: not including signal tower, height: 515 mm |
Weight |
500 kg |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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