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TR5001
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TR5001
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INTRODUCTION
Entworfen als erweiterbare Plattform für das Testen von Platinen, bietet der TR5001 eine sparsame, anpassbare Lösung, die die Testanforderungen der meisten Kunden in vollem Umfang erfüllen kann. Der TR5001 enthält MDA mit wählbarer ICT- und Funktionstest-Funktionen, die Produktionslinien- Personalkosten senken, Testzeit sparen und die Produktivität erhöhen können.
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• Modulare Upgrade-Optionen von MDA zu ICT und Funktionstest
• Testlösung für hohe Fehlerabdeckung
• Begrenzte Zugriffslösung und Funktionstesterweiterung mit PXI-Modulen
• Freundliche Benutzeroberfläche mit schneller und einfacher Programmentwicklung
Tester Specifications
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Analog/hybrid test points |
3200 analog or maximum digital test points: 1600 |
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Operating System |
Microsoft® Windows 10 |
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Fixture Type |
Offline press type fixture |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Optional Components
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Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Board Handling
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Max PCB Size |
Standard: 420 x 300 mm
Option: 500 x 350 mm or larger |
Dimensions
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WxDxH |
1050 x 850 x 1735 mm |
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Weight |
300 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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