产品介绍

自动光学检测机 (AOI)

TR7700QE-S建立在具有5.5 µm高分辨率与12 MP成像技术的高精准度平台上，适用于半导体和封装行业。一站式3D AOI能够检测打线接合、黏晶、SMD、凸块与锡点等缺陷，并且智能 3D AOI解决方案可通过量测功能和灵活的检测演算法提升准确性。

• 半导体与封装技术检测
• 超高精准度走停式3D AOI
• 打线接合与黏晶缺陷检测
• 即时通过TRI智能编程进行检测

Defects
Measurement

WxDxH
Weight

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	N/A
Imaging Resolution	5.5 µm
Lighting	Multi-phase true color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	12 Mpix@ 5.5 µm: 4 mm

Imaging Speed

12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec
12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec

Note: Depending on component distribution

X-Axis Control	Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional)
Y-Axis Control	Dual driven ballscrew + AC-servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Max PCB Size	330 x330 mm* *Depending on component distribution, the vailable PCB size could be different
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm. Optional: 100 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

WxDxH	1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	920 kg

Capabilities
Defects

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