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德律科技 - Industry 4.0 PCBA Inspection M2M Solution at NEPCON Japan 2018

2017/11/29

[November 29, 2017 – Taipei, Taiwan] Test Research, Inc. (TRI - 德律科技), the leading test and inspection systems provider for the electronics manufacturing industry will join NEPCON Japan held at Tokyo Big Sight to showcase its Industry 4.0 Inspection solution, YMS 4.0, along with TRI’s complete PCBA manufacturing Inspection solutions. Visit TRI at booth #E33-4 and discuss your quality issues with TRI's experts.
TRI’s VP of Sales and Marketing Jim Lin commented on the occasion: “The PCBA manufacturing industry has never been so close to experience the full Industry 4.0 Solutions. Visit TRI - 德律科技 during NEPCON Japan to experience TRI’s YMS 4.0 solution and discover the benefits of real time M2M communication for centralized inspection!”

 

M2M Communication

Machine to machine (M2M) Communication is the data transmission between devices, sensors and other machines. M2M communication enables the collection of Big Data between different sources. The processing of this data facilitates fully automated real time process control for Smart Factories with production analysis, defect image linkage and SPC trend monitoring capabilities. M2M communication is key for the Industry 4.0 development. 

The highlights of TRI’s portfolio will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI. Built with CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing. TRI will also present the TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing. 

Depth from Focus

Depth from Focus (DFF) is a revolutionary 3D sensing technique that searches for the optimal focus position and measures the depth of the image. The DFF algorithm will create 3D model of the component and its surroundings.

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About TRI 德律科技

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at trijp@tri.com.tw or call +81 3 62730518.