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TRI to Feature Smart Factory 3D Inspection at IPC APEX 2017

2017/01/10

[January 10, 2017 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry will join IPC APEX 2017 held at San Diego Convention Center on February 14-16 featuring a one-stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit booth #1909 to see TRI's all new 3D SPI, 3D AOI, 3D CT AXI and ICT solutions in action and discuss your inspection requirements with TRI's experts.

TRI's VP of Sales and Marketing Jim Lin commented on the occasion, "Our engineers have taken TRI 3D solutions to the next level with high performance upgrades and smart factory integration across all our product lines. With faster, more accurate results and easier programming, we are thrilled to share the new experience with global and US-based manufacturers and partners at IPC APEX 2017. Visit TRI during the show to discover how far the leading 3D inspection solutions can take your production!"

Presenting an integrated solution for smart factory PCBA productions, TRI will exhibit award winning SPI, AXI and ICT solutions along with our brand new 2D+3D AOI, TR7500QE. Our expert staff will be ready to discuss the entire one-stop solution for ensuring PCBA production quality in smart manufacturing environment.

TRI product lineup

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at triusa@tri.com.tw or call +1 (408) 567-9898.