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TRI Brings the Future of Inspection to NEPCON China 2015

2015/02/28

TRI Brings the Future of Inspection to NEPCON China 2015


[March 20, 2015 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON China 2015 exhibition. Visit us at booth B-1F20 in Hall 1 of Shanghai World Expo & Convention Center from April 21 ~ 23, 2015 for a personal tour of the latest developments in PCBA inspection.


TRI’s 2015 portfolio includes new TR7007Q stop-and-go SPI system designed for maximum accuracy with great cost-performance. Also launching in 2015 is a unique CT upgrade for TRI’s 3D AXI systems, bringing 3D CT inspection to our award winning x-ray inspection series. The complete demoed inspection and testing range includes high speed TR7500 SIII 3D AOI and TRI’s acclaimed ICT solutions for inline and desktop deployment with parallel testing.


Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth B-1F20 for a personal tour of TRI’s solution lineup.


About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at sales@tri.com.tw or call +886-2-2832 8918.