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TR7600

The TR7600 in-line Automated 3D X-Ray Inspection system uses X-Ray technology to penetrate PCBs and components to capture test images. It is the ideal solution for testing BGA components and areas not accessible by other test technologies.

TRI's proprietary image evaluation technology uses nine images captured with different angles. It appraises the dark and light areas, separates the different image slices and calculates the different slice heights during inspection for manufacturing defects. Data is sent to the TR7600 Repair Station for analysis and action by manufacturing staff.

		In-line, 3D high-speed dynamic imaging AXI system for PCBA inspection.
		Excellent inspection and operation technology provides ultra‑high defect-detection rates and enhances the coverage rate of defects.
		Can detect BGA opens and shorts, as well as missing, billboard, tombstone, skew, IC lead up, DIP sodering defects for fine-pitch components.
		ATPG flow guides users to create the inspection program quickly and easily.
		Repair Station system helps user to confirm the defect easily with user-friendly graphic interface and provides the SPC calculation and reports.
		Best Price/Performance Ratio of all in-line AXI systems.
		Available to link with YMS to integrate and analyze the data of all production lines.

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