3D Solder Paste Inspection (SPI)

Quality at the start of the SMT process comes from improving the quality of solder paste printing. The TR7006 three-dimensional solder paste inspection system can quickly measure the area, volume, and thickness of every solder joint and can detect short circuits. It targets tiny products, preventing them from bad connections as a result from small solder joints and lack of solder, component vibrations and heat expansions, improving the product's quality.  

TR7006 separates products with bad solder printing at the beginning of the SMT process. This has two benefits: it can immediately offer the information to the solder printer to modify the parameters, and it also helps to avoid producing defective products. Thus, TR7006 increases productivity and reduces the cost of manufacturing and repair.