Solutions

Automated Optical Inspection (AOI)

TR7500 SIII 3D


TR7500 SIII 3D

INTRODUCTION

TRI's optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

• High Speed Color Multi-angle Inspection of Up to 01005 Components
• High Defect Coverage Using Hybrid 2D+3D Inspection Technology
• True 3D Profile Measurement Using Dual Laser Units
• Rapid Programming Interface with Auto Library and Offline Editing

Please login to access member content

Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	1.3 Mpix or 6.5 Mpix (factory setting)
Imaging Resolution	Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm

Inspection Performance

Imaging Speed

4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control	Ballscrew + AC-servo controller
Y-Axis Control	Ballscrew + AC-servo controller
Z-Axis Control	N/A
X-Y Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7500 SIII 3D: 510 x 460 mm* TR7500L SIII 3D: 660 x 460 mm TR7500 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane * The testable PCB size range will vary depending on the configuration of laser probe
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	15 mm/25 mm/48 mm [optional] Note: (1) Laser resolution@ 50 μm is 25 or 48 mm (optional) (2) Laser resolution@ 20 μm is 25 mm (3) Laser resolution@ 10 μm is 15 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

Dimensions

WxDxH	TR7500 SIII 3D: 1100 x 1670 x 1550 mm TR7500L SIII 3D: 1300 x 1630 x 1655 mm TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm
Weight	TR7500 SIII 3D: 1010 kg TR7500L SIII 3D: 1250 kg TR7500 SIII 3D DL: 1150 kg

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

RELATED PRODUCTS

Back To List