[July 21, 2015 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON South China 2015 exhibition. Visit us at booth C11 in Hall 1 of Shenzhen Convention & Exhibition Center from August 25 ~ 27, 2015 for a personal tour of the latest developments in PCBA inspection.
TRI’s 2015 updated portfolio includes new TR7700Q stop-and-go 3D AOI system designed for maximum accuracy using the latest digital fringe projection technology. TR7007D is a cost efficient 3D SPI system combining very high resolution and intelligent software for detailed, reliable inspection.
Also launching in 2015 is a unique CT upgrade for TRI’s 3D AXI systems, bringing 3D CT inspection to our award winning x-ray inspection series. The complete demoed inspection and testing range includes high speed stop-and-go TR7710 inline and desktop AOI series and TRI’s acclaimed compact ICT solutions for inline and desktop deployment with parallel testing.
Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth C11 in hall 1 for a personal tour of TRI’s solution lineup.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at marketing@tri.com.tw or call +886-2-2832 8918.
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